Fully Automatic Wafer Tape Lamination

Cuon CUWLA-120 / CUWLA-080

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This lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.

Features

  • Application wafer : 6”,8” or 8”, 12”
  • application tape : normal & uvtape
  • UPH : 55 wafer/hr(12”) / 60 wafer/hr(8”)
  • Main controller : PLC
  • Data & GUI : PC
  • Blade life time : 500 sheets
  • Wafer center accuracy : +/-0.5mm
  • Blade temp : 120℃ +/-5
  • Chuck temp : 80℃ +/-5
  • Tapeconsumption : 30~40mm
  • Wafer angle : 0′, 90’, 180’, 270’
  • Tape tension controller
  • Tape cutting angle adjustable : 70’~90’
  • Tape thickness : 130 ㎛ ~ 600 ㎛
  • Tape width : 230mm, 250mm for 8” / 330mm for 12”

 

Other Information
• Minimum Order Quantity: 1 piece

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