Grip Ring for Wafer | GR
Technovision GR series
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Categories : SEMICONDUCTOR CONSUMABLES , Technovision
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The grip rings hold elastic film/tape, cloth, and paper taut between their inner and outer rings. The rings are easy to remove and are reusable.The grip rings hold elastic film/tape, cloth, and paper taut between their inner and outer rings. The rings are easy to remove and are reusable.
Features
- Wafer expansion after dicing
- Substitute for metal dicing frames
- Wafer/film attachment jig
- Others
Inner ring ID/OD Outer ring ID/OD
GR-4 140mm / 146mm 146mm / 152mm
GR-5 170mm / 178mm 178mm / 186mm
GR-6 195mm / 203mm 203mm / 210mm
GR-8 227mm / 237mm 237mm / 247mm
GR-12 * 331.5 mm / 347 mm 347 mm / 357 mm
Other Information
- Minimum Order Quantity: Please contact us
