SEMICONDUCTOR CONSUMABLES

Dicing Die Attach Film

Dicing Die Attach Film

Furukawa Electric AF Series

UV tape for wafer dicing

UV tape for wafer dicing

Furukawa Electric UC Series

UV tape for wafer backgrinding and Etching

UV tape for wafer backgrinding and Etching

Furukawa Electric SP Series

UV tape for BGA and CSP Package Dicing

UV tape for BGA and CSP Package Dicing

Furukawa Electric FC Series

Grip Ring for Wafer

Grip Ring for Wafer

Technovision GR series

Non UV tape for Wafer Backgrinding

Non UV tape for Wafer Backgrinding

Furukawa Electric CP Series

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