Thermosonic Peg Bonder
Attribute:
SKU : Hybond 616B-005
Categories : SEMICONDUCTOR EQUIPMENT , Hybond ,
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Model 616B-005 thermosonic single channel peg bonder has been designed to perform thermosonic attachment of insulated or bare wire / ribbon.
This unit contains a built-in in temperature controller.
Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.
Other Information
- Minimum Order Quantity: 1 piece
