Model UDB-141 is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design.
The UDB-141 is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. A turret head allows the machine to pickup preforms and die with separate collets. A preform pick up system and a 4:1 X-Y manipulator for package location can be added depending on the application.
The UDB-141 is modular and easily adapted to various modifications. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.