Eutectic Die Bonder
Attribute:
SKU : Hybond UDB-206A
Categories : SEMICONDUCTOR EQUIPMENT , Hybond ,
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HYBOND’s Model UDB-206A is a manual eutectic die bonder that bonds devices using heat and vibration at an ultrasonic frequency. It provides precise control of ultrasonic scrub energy, force, and time (scrub duration) to provide consistant wetting without damaging die.
An optional pulse-heating stage and controller can be easily added to minimize thermal stress on delicate die.
The UDB-206A is ideal for low to medium volume and high reliability production.
Other Information
- Minimum Order Quantity: 1 piece
