Fully Automatic LC Tape Lamination
Attribute:
SKU : Cuon CULCA-80 / CULCA-120
Categories : SEMICONDUCTOR EQUIPMENT , CUON ,
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Fully auto LC tape lamination which laminates LC tape to wafer backside after back grinding.
• Application wafer : 6”,8” or 8”, 12”
• Cutting size : 299.7mm, 199.7mm
• Application tape : LC2850 (adwill)
• Tape thickness : 22um,25um, 40um
• UPH : 30 wafer/hr(8”), 25wafer/hr(12”)
• Main controller : PLC
• Data & GUI : PC
• Core life time : 60,000 sheets
• Chuck temp : 100℃ +/-5
• Bond roller temp : 80℃
• Chuck positioning by vision system
• Core type tape cutting
• Protect tape auto detaping(removal tape)
• Wafer cleaning function
• Cooling chuck installed
• Wafer center accuracy : +/-0.5mm
• Tapeconsumption : 30~40mm
• Tape tension controller
Other Information
- Minimum Order Quantity: 1piece
