Features
- Ring frame cassette : 2 ports
 - Wafer capability : 6 inch & 8 inch
 - Application wafer : Glass Wafer/Silicon Wafer
 - Application tape : Normal or UV tape
 - Ring frame capability : 8 inch
 - Wafer thickness : 100 um~
 - Wafer warpage : 4 mm~
 - ESD : 1000V~100V, 10secs, Ion balance : +/-50V
 - Operation : 15” touch monitor, Data & GUI by PC
 - Main system control : PLC (Omron)
 - EMO switch : 4ea
 - Noise level : Max. 80dB
 - UPH : 50 frame/hr
 - Grip ring buffer : Up to 40 ea
 - Label size : 10㎜ x 50㎜
 - Label attach position : 0°, 90°, 180° and 270°
 - Label attach position accuracy : ±1.0㎜
 - Tape remained length after cutting : 0.5 mm ~ 1 mm
 
Optional items:1. Handy scanner
2. SECS Gem communication
3. Ultra-hepa filter
4. Wafer ID reader
 
Other Information
- Minimum Order Quantity: 1 piece