Fully Automatic Tape Expander

Cuon CUTEA-080

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Features

  • Ring frame cassette : 2 ports
  • Wafer capability : 6 inch & 8 inch
  • Application wafer : Glass Wafer/Silicon Wafer
  • Application tape : Normal or UV tape
  • Ring frame capability : 8 inch
  • Wafer thickness : 100 um~
  • Wafer warpage : 4 mm~
  • ESD : 1000V~100V, 10secs, Ion balance : +/-50V
  • Operation : 15” touch monitor, Data & GUI by PC
  • Main system control : PLC (Omron)
  • EMO switch : 4ea
  • Noise level : Max. 80dB
  • UPH : 50 frame/hr
  • Grip ring buffer : Up to 40 ea
  • Label size : 10㎜ x 50㎜
  • Label attach position : 0°, 90°, 180° and 270°
  • Label attach position accuracy : ±1.0㎜
  • Tape remained length after cutting : 0.5 mm ~ 1 mm

Optional items:
1. Handy scanner
2. SECS Gem communication
3. Ultra-hepa filter
4. Wafer ID reader

 

Other Information
• Minimum Order Quantity: 1 piece

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