Fully Automatic Wafer Mounter

Cuon CUWMA-80 / CUWMA-120

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This mounter system automates application of protection fixing tape during dicing.

Features

  • Application wafer : 6”,8” or 8”, 12”
  • Wafer thickness : 200um <= (8”) / 330um <= (12”)
  • Wafer warpage : 4mm>=
  • Tape wide : 300mm, 400mm
  • Application tape : normal & uv tape
  • UPH : 45 wafer/hr(12”), 50 wafer/hr(8”)
  • Main controller : PLC
  • Data & GUI : PC
  • Blade life time : 10,000 sheets
  • Ring frame stack : 100ea
  • Wafer center accuracy : +/-0.5mm
  • Pre-cut tape accuracy : +/-2mm
  • Chuck temp : 80℃ +/-5
  • Tape consumption : 30~40mm
  • Chuck surface cleaning function
  • Wafer angle : 0′, 90’, 180’, 270’
  • Tape tension controller

 

Other Information
• Minimum Order Quantity: 1 piece

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