Fully Automatic Wafer Mounter
Attribute:
SKU : Cuon CUWMA-80 / CUWMA-120
Categories : SEMICONDUCTOR EQUIPMENT , CUON ,
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This mounter system automates application of protection fixing tape during dicing.
Features
- Application wafer : 6”,8” or 8”, 12”
- Wafer thickness : 200um <= (8”) / 330um <= (12”)
- Wafer warpage : 4mm>=
- Tape wide : 300mm, 400mm
- Application tape : normal & uv tape
- UPH : 45 wafer/hr(12”), 50 wafer/hr(8”)
- Main controller : PLC
- Data & GUI : PC
- Blade life time : 10,000 sheets
- Ring frame stack : 100ea
- Wafer center accuracy : +/-0.5mm
- Pre-cut tape accuracy : +/-2mm
- Chuck temp : 80℃ +/-5
- Tape consumption : 30~40mm
- Chuck surface cleaning function
- Wafer angle : 0′, 90’, 180’, 270’
- Tape tension controller
Other Information
- Minimum Order Quantity: 1 piece
