Fully Automatic Wafer Tape Remover

Cuon CUWRA-80 / CUWRA-120

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This wafer remover system automates the removal of the protection tape after back grinding.

Features

  • Application wafer : 6”,8” or 8”, 12”
  • Wafer thickness : 200um <= (8”) / 330um <= (12”)
  • Wafer warpage : 4mm>=
  • Application tape : normal & uvtape
  • UPH : 50 wafer/hr(12”) / 60 wafer/hr(8”)
    [based on remove speed 50mm/s UV time 5 sec]
  • Main controller : PLC
  • Data & GUI : PC
  • Wafer center accuracy : +/-0.5mm
  • Chuck temp : 60℃ +/-5
  • Peel bar temp : 180℃ +/-5
  • Peeling angle adjustable
  • Chuck surface cleaning function
  • Wafer angle : 0′, 90’, 180’, 270’
  • Tape tension controller
  • Vision alignment
  • Removal tape & heat seal used
  • Porous remove chuck
  • UV irradiation speciation ;
    1) 365 nm wave
    2) high pressure mercury lamp
    3) 100~1000 mj/㎠ dosage

 

Other Information
• Minimum Order Quantity: 1 piece

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