Fully Automatic Wafer Tape Remover
Attribute:
SKU : Cuon CUWRA-80 / CUWRA-120
Categories : SEMICONDUCTOR EQUIPMENT , CUON ,
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This wafer remover system automates the removal of the protection tape after back grinding.
Features
- Application wafer : 6”,8” or 8”, 12”
- Wafer thickness : 200um <= (8”) / 330um <= (12”)
- Wafer warpage : 4mm>=
- Application tape : normal & uvtape
- UPH : 50 wafer/hr(12”) / 60 wafer/hr(8”)
[based on remove speed 50mm/s UV time 5 sec] - Main controller : PLC
- Data & GUI : PC
- Wafer center accuracy : +/-0.5mm
- Chuck temp : 60℃ +/-5
- Peel bar temp : 180℃ +/-5
- Peeling angle adjustable
- Chuck surface cleaning function
- Wafer angle : 0′, 90’, 180’, 270’
- Tape tension controller
- Vision alignment
- Removal tape & heat seal used
- Porous remove chuck
- UV irradiation speciation ;
1) 365 nm wave
2) high pressure mercury lamp
3) 100~1000 mj/㎠ dosage
Other Information
- Minimum Order Quantity: 1 piece
