Semi Auto Wafer Mounter

Cuon CUWMS-080 / CUWMS-120

Share

Share

Semi-auto wafer mounter that mounts wafer onto dicing tape once the operator supplies The wafer and ring frame by hand

Features

  • Application wafer : 6”,8” or 8”, 12”
  • Wafer thickness : 200um <= (8”) / 330um <= (12”)
  • Wafer warpage : 4mm>=
  • Tape wide : 300mm, 400mm
  • Application tape : normal & uvtape
  • UPH : 40~50 wafer/hr(8”,12”)
  • Main controller : PLC
  • Data & GUI : PC
  • Blade life time : 10,000 sheets
  • Chuck temp : 80℃ +/-5
  • Tapeconsumption : 30~40mm
  • Wafer angle : 0′, 90’, 180’, 270’

 

Other Information
• Minimum Order Quantity: 1 piece

Powered by MakeWebEasy.com