Semi Auto Wafer Mounter
Cuon CUWMS-080 / CUWMS-120
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Categories : SEMICONDUCTOR EQUIPMENT , CUON
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Semi-auto wafer mounter that mounts wafer onto dicing tape once the operator supplies The wafer and ring frame by hand
Features
- Application wafer : 6”,8” or 8”, 12”
- Wafer thickness : 200um <= (8”) / 330um <= (12”)
- Wafer warpage : 4mm>=
- Tape wide : 300mm, 400mm
- Application tape : normal & uvtape
- UPH : 40~50 wafer/hr(8”,12”)
- Main controller : PLC
- Data & GUI : PC
- Blade life time : 10,000 sheets
- Chuck temp : 80℃ +/-5
- Tapeconsumption : 30~40mm
- Wafer angle : 0′, 90’, 180’, 270’
Other Information
• Minimum Order Quantity: 1 piece
