HYBOND's Model EDB-140B is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement.
The EDB-140B can be fitted with a waffle pack/gel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with HYBOND's micro-dispense head for extremely low volume epoxy dispensing.
This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system.
The EDB-140B is modular and easily adapts to modifications to accommodate fixturing for custom packages.