Laser Vision Measurement

Features

• Ideal inspection for solder paste thickness, dealing with the increasingly growth of fine pitch, enhanced printing technology and high precision requirement
• Prevent various kinds of defect from printing process, such as the bridging, deviation location, etc.
• Laser vision measurement, without contact and damage
• Statistical charts and process capability index be provided as the real-time data for quality control
• Easy to operate, fast gather the printing data for reference
• Measure printed solder thickness, height, length and interval
• Providing various kind of statistical charts, such as the distributive thickness chart, R control chart and process capability index: Cp, Cpm ,Cpk for reference
• Analyze thickness for solder cross-section
• Inspect length and thickness for other kinds of materials