Solder Paste Mixer

JAPAN UNIX UM-113S

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The most suitable for mixing and defoaming of small volume paste.
Used for mixing various paste such as silver epoxy, adhesive, encapsulate, various epoxy, etc.

Features

  • Mixing and defoaming high-viscosity paste.
  • The centrifugal rotation contributes to remove the bubbles and air inside of paste.
  • Flexible programming enabled with PC management software.
  • Mixing capability: Net80g/120ml container can be mixed.


Other Information
• Minimum Order Quantity: 1 piece

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