There are two high-pressure Hg lamp models: one supporting up to 200 mm (8") wafers and the other supporting up to 300 mm (12") wafers. These UV curing systems provide uniform exposure to the entire area of a rotating workpiece. Furthermore, these Hg lamp model UV curing systems are equipped with a proprietary, high-efficiency, low flow rate N2 purge function. This allows significantly lower level of N2 usage compared with existing systems, while ensuring the proper displacement. Not only do these characteristics contribute to lower running costs by reducing the consumption of power and gas. They also improve the efficiency of the manufacturing process as a whole by reducing the system cost and minimizing usage of precious clean room floor space.
Supporting wafers up to 200 mm (8")
Supporting Wafers up to 300 mm (12")
Dimensions: 650(W)×800(D)×980 (H)