A minute application model for Φ0.2-mm point application and 0.2mm width line application
- High accuracy even with minute amounts
Application is highly accurate and stable even with minute μL-level amounts.
- Lightweight, compact design
By reducing the casing volume as much as possible, we cut down on the volume of waste fluid. It can be installed with ease on miniaturized tabletop robots.
- Stable application over an extended period of time
With a structure not easily affected by changes in viscosity brought on by fluid temperature, lots or the like, it stabilizes the application amount and contributes to a decrease in the number of adjustments and the amount of down time.
- Point application of minute quantities of soldering paste to a PCB
- Application of waterproofing sealant to the outer edge of a camera lens
Soldering paste, Silver paste, Nickel paste, Copper paste, Silicone adhesive, Epoxy adhesive, UV-curing adhesive, Insulating adhesive, Conductive adhesive, Die bonding paste, Underfill agents, Thermal grease, Silicone grease, Industrial grease, Lubricating oil, Paint, Ink, Organic solvents, Coating agents, Desiccating agents and various slurries
- Minimum Order Quantity : 1 pcs